General Feature
- ApplicationClient PCs
- Capacity250GB (1GB=1 Billion byte by IDEMA) * Actual usable capacity may be less (due to formatting, partitioning, operating system, applications or otherwise)
- Form FactorM.2 (2280)
- InterfacePCIe Gen 4.0 x4, NVMe 1.3c
- Dimension (WxHxD)80.15 x 22.15 x 2.38 (mm)
- WeightMax 9.0 g Weight
- Storage MemorySamsung V-NAND 3-bit MLC
- ControllerSamsung Elpis Controller
- Cache MemorySamsung 512MB Low Power DDR4 SDRAM
Special Feature
- TRIM SupportSupported
- S.M.A.R.T SupportSupported
- GC (Garbage Collection)Auto Garbage Collection Algorithm
- Encryption SupportAES 256-bit Encryption (Class 0)TCG/Opal IEEE1667 (Encrypted drive)
- WWN SupportNot supported
- Device Sleep Mode SupportYes
Performance
- Sequential ReadUp to 6,400 MB/s * Performance may vary based on system hardware & configuration
- Sequential WriteUp to 2,700 MB/s * Performance may vary based on system hardware & configuration
- Random Read (4KB, QD32)Up to 500,000 IOPS * Performance may vary based on system hardware & configuration
- Random Write (4KB, QD32)Up to 600,000 IOPS * Performance may vary based on system hardware & configuration
- Random Read (4KB, QD1)Up to 22,000 IOPS * Performance may vary based on system hardware & configuration
- Random Write (4KB, QD1)Up to 60,000 IOPS * Performance may vary based on system hardware & configuration
Environment
- Average Power Consumption (system level)*Average: 5 W *Maximum: 7 W (Burst mode) * Actual power consumption may vary depending on system hardware & configuration
- Power consumption (Idle)Max. 35 mW * Actual power consumption may vary depending on system hardware & configuration
- Allowable Voltage3.3 V ± 5 % Allowable voltage
- Reliability (MTBF)1.5 Million Hours Reliability (MTBF)
- Operating Temperature0 – 70 ℃ Operating Temperature
- Shock1,500 G & 0.5 ms (Half sine)
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